SK Telecom, Supermicro and Schneider Electric Sign MOU on Total Solutions for AI Data Center Deployment
- Collaborate on adoption of a pre-fabricated modular model for integrated server and infrastructure design
- Accelerated artificial intelligence data center (AIDC) deployment and enhanced cost efficiency to strengthen global responsiveness and competitiveness
The agreement, signed at MWC26, aims to shorten AIDC construction timelines and help alleviate supply bottlenecks by leveraging the combined expertise of the three companies.
The companies will collaborate on a pre-fabricated modular model that integrates AI computing servers with supporting power and cooling infrastructure into a single pre-manufactured module, enabling AIDCs to be constructed in a building-block configuration.
Compared with the conventional steel-reinforced concrete (SRC) method, in which servers and infrastructure are installed sequentially after completion of the data center building, the pre-fabricated modular model offers both faster deployment and improved cost efficiency.
In addition, modules can be deployed in phases as demand grows, enhancing scalability while reducing the burden of significant upfront investments and enabling flexible responses to evolving market needs.
Under the MOU,
"Through collaboration with global leaders in the AIDC business, we are advancing a total solution based on a pre-fabricated modular model," said
"In the era of AI, the true measure of competitiveness lies in how fast and sustainably organizations can deliver high-performance infrastructure," said
"Supermicro is excited to partner with
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