Alpha and Omega Semiconductor Expands Surface Mount Package Offering with New LFPAK 5x6 Package for High Performance and High-Reliability Requirements
New AOS LFPAK 5x6 package provides the ruggedness needed for high-current applications in industrial, server power, solar, and telecommunication applications
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New AOS LFPAK 5x6 package provides the ruggedness needed for high-current applications in industrial, server power, solar, and telecommunication applications (Graphic: Business Wire)
AOS’s LFPAK packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a ruggedized solution for board-level environmental stresses. The gull-wing leads also enable optical inspection during PCB manufacturing. Another feature enhancement is the LFPAK’s larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications. All these features significantly improve the robustness of the MOSFET, and utilizing AOS’s advanced shielded gate MOSFET Technology (AlphaSGT™) enables designers to find an optimized solution to achieve high reliability under the harshest environmental conditions.
“Designers have long trusted AOS power semiconductors in their applications, and LFPAK 5x6 will expand solution capability,” said
Technical Highlights |
|||||
Part Number |
VDS (V) |
VGS (±V) |
ID @ 25°C (A) |
RDS(ON) max (mΩ) at VGS=10V |
Tj max (°C) |
40 |
20 |
352 |
1.5 |
175 |
|
40 |
20 |
374 |
1.5 |
175 |
|
40 |
20 |
200 |
2.6 |
175 |
|
60 |
20 |
294 |
2 |
175 |
|
100 |
20 |
187 |
4.7 |
175 |
Pricing and Availability
The LFPAK 5x6 family is immediately available in production quantities with a lead time of 14-16 weeks. The unit price for 1,000 pieces for AOLF66412, AOLF66413, AOLF66417, AOLF66610, and AOLF66910 are respectively
About AOS
Forward-Looking Statements
This press release contains forward-looking statements that are based on current expectations, estimates, forecasts, and projections of future performance based on management’s judgment, beliefs, current trends, and anticipated product performance. These forward-looking statements include, without limitation, references to the efficiency and capability of new products and the potential to expand into new markets. Forward-looking statements involve risks and uncertainties that may cause actual results to differ materially from those contained in the forward-looking statements. These factors include but are not limited to, the actual product performance in volume production, the quality and reliability of the product, our ability to achieve design wins, the general business and economic conditions, the state of the semiconductor industry, and other risks as described in the Company’s annual report and other filings with the
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