BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

• Revenue in EUR (TTM)613.70m
• Net income in EUR177.59m
• Incorporated1995
• Employees1.81k

• Location
  BE Semiconductor Industries NVRatio 6DUIVEN 6921 RWNetherlandsNLD
• Phone+31 263194500
• Fax+31 263194550
• Websitehttps://www.besi.com/